Veelo Technologies has a new small and lightweight form factor hot bonder used to control heat sources applied in composite processing and composite repair applications.
Veelo Technologies' new small and lightweight form factor hot bonder is used to control heat sources applied in composite processing and composite repair applications. The new hot bonder is a mere 13.37 inches by 11.62 inches by 6 inches and weighs in at 10.7 lbs. The weight increases to just 12.5 lbs. when equipped with an optional integrated electric vacuum pump and vacuum sensor.
Veelo's hot bonder is UL 508A rated and is designed with a PC-based control architecture. The easy-to-use unit includes a 7-inch touchscreen, eight mini-TC receptacles, two USB ports, and an ethernet port for data transfer. The Veelo Hot Bonder is powered via 100-240 VAC with 30A maximum capacity. Over-the-air updates, remote control, and monitoring are available options.
