ENDICOTT, NY – Endicott Interconnect Technologies, Inc. (EI) today announced it has acquired the assets of eV PRODUCTS, Inc., a business of II-VI Incorporated (Nasdaq Global Select: IIVI) and headquartered in Saxonburg, PA. eV PRODUCT’s research and development, sales and manufacturing operations, along with its intellectual property and 65 employees will become part of EI’s Microelectronics Division. Financial terms were not disclosed.
eV PRODUCTS develops and manufactures solid-state room temperature X-ray Detectors and Gamma-ray Detectors for industrial, medical, homeland security and laboratory applications. Additionally, eV PRODUCTS is the leading manufacturer of Cadmium Zinc Telluride (CZT) radiation detection products, including components and subassemblies optimized for specific industry applications.
“eV is one of the very few manufacturing operations focused on providing high quality, engineered materials and components. This critical technology will be integrated into EI’s portfolio to further extend our electronics packaging strategy of delivering highly customized and technology driven solutions to customers in the medical, security and other commercial markets,” stated James J. McNamara, President and CEO at EI.
This new business will be named eV Microelectronics, a division of Endicott Interconnect Technologies and will report directly to James McNamara. While there are opportunities for synergy in the corporate support services such as IT, finance, HR, procurement and marketing, eV Microelectronics will continue to operate their sales, manufacturing and research functions separate from EI in the 35,000 sq. ft. Saxonburg facility.
About Endicott Interconnect Technologies
Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a supplier of electronic interconnect solutions consisting of fabrication and assembly of complex printed circuit boards, advanced flip chip and wire bond semiconductor packaging as well as precision equipment manufacturing and integration. EI product lines meet the needs of markets including defense and aerospace, communications and computing, semiconductor, advanced test equipment, and medical, where highly reliable products built in robust manufacturing operations are critical for success. With more than 45 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know how that provide customers with a time-to-market advantage and competitive differentiation. For more information about EI and its products, please visit www.endicottinterconnect.com.
He had been the President & CEO of Endicott Interconnect since its inception in 2002 as a divestiture of IBM's Microelectronics Division; he will be succeeded by Jim Matthews Jr.
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This contract supports the exploration and development of advanced, high speed, electronic packaging technologies.
Department of Defense Awards Endicott Interconnect Technologies Contract Modifications Totaling $66.1M
The company also received a $15.8 million contract modification for spares in support of program sustainment.