ENDICOTT, NY — December 14, 2009
Endicott Interconnect Technologies, Inc. (EI) today announced that the Company has been awarded a $39.5M research & development contract modification by the U.S. Department of Defense for phase 2 development of electronic packaging technologies including printed circuit boards and organic substrates for a next generation super computer application.
This contract, originally announced in December, 2008, supports the exploration and development of advanced, high speed, electronic packaging technologies; specifically system development, printed circuit board and substrate design along with the evaluation of alternative material sets.
“Development of these future technologies is progressing well and we continue to actively recruit engineers across multiple disciplines in our efforts to develop the next generation of scientists and engineering personnel to support our customer’s needs,” stated Rajinder Rai, VP of EI’s Microelectronics Division.
